Diamond wire sawing is a critical cutting technology in the semiconductor and photovoltaic industries, employed to slice single-crystal silicon ingots into thin wafers. The process utilises a ...
The manufacturing of wafers for the microelectronics and photovoltaic industries involves a multitude of critical processes. One of the first of these is the precision cutting of ingots or crystals, ...
Once, sawing was considered a secondary machining process and saws were used mostly for cutting bar stock in preparation for other machining operations. In recent years, the development of new types ...
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