Qualcomm has confirmed an event in China on April 2, and while the company hasn’t named its product yet, all signs point to the introduction of the Snapdragon 8s Gen 4—or Snapdragon 8s Elite ...

Fundamental analysis highlights concerns over Intel's ability to meet production goals and revive its server processor business. The company's EBITDA may see only a minor uptick – around 5% ...

We think the best CPU to pair with the Intel Arc B580 is the Core Ultra 7 265K. Both target the mid-range segment and should result in a good all-Intel build. While the Arrow Lake processors didn't ...

The CPU layout is the same: 2x Cortex Oryon V2 Phoenix L at 4.32 GHz and 6x Oryon V2 Phoenix M at 3.53 GHz, with the Adreno 830 GPU handling graphics. Both phones ship with Android 15 layered with ...

Intel is planning a refreshed lineup of new Intel gaming CPUs aimed at gaming enthusiasts, according to a new rumor. The Intel Arrow Lake refresh will apparently deliver new overclockable K and KF ...

That experience helps me pinpoint exactly which options are the best for you, with considerations for features beyond the CPU, like display quality, battery life, memory, and storage. My top pick ...

After cleaning and removing debris from the CPU socket, without further repair, the motherboard can boot up successfully with original onboard BIOS. It also passed long-term stress tests. 2.

The 9800X3D is quite simply the fastest gaming CPU we’ve ever tested, and it absolutely obliterates the current Arrow Lake competition from Intel. This CPU tops our frame rate charts in ...

So, it seems like for a budget build, the LGA 1151 CPUs are still a viable option if you want to stick with Intel, but with the performance AMD processors have been displaying, we can’t help but ...

Your choice of processor is the most important factor when considering how fast you need your computer to be and how much to spend. Intel was traditionally the dominant player in laptop processors, ...

HBM—essentially a 3D structure of vertically stacked DRAM dies on top of a logic die—relies on advanced packaging technologies like through silicon vias (TSVs) while using a silicon interposer for ...

The scientists said that the new transistor could be integrated into chips that could one day perform up to 40% faster than the best existing silicon processors made by U.S. companies like Intel.